Starting date: Nov 1, 2024 >June 30 2029
Lifetime: 4.5 years
Program in support: APECS is co-funded by the Chips Joint Undertaking and national funding authorities of Austria, Belgium, Finland, France, Germany, Greece, Portugal, Spain, through the Chips for Europe Initiative.
Status of project: on going
Project Coordinator:
Fraunhofer
Partners:
- Fraunhofer Group for Microelectronics
- Ferdinand-Braun-Institut, Leibniz-Institut für Höchstfrequenztechnik
- IHP GmbH - Leibniz Institute for High Performance Microelectronics
- TU Graz
- VTT
- Imec
- CEA-Leti
- FORTH
- Institute of Microelectronics of Barcelona (IMB-CNM-CSIC)
- International Iberian Nanotechnology Laboratory (INL)
Target market: Telecommunications, AI/machine learning, medical & scientific instrumentation, High-performance computing, sensor systems, industrial manufacturing
Investment: € 730 million over 4,5 years
|
Vision
Innovating right where European industry needs it most
To be the leading European platform for advanced packaging and heterogeneous integration innovation, APECS envisions a future where the European semiconductor industry is not only internationally competitive, but also a driving force behind the next generation of integrated systems.
By bringing together diverse technologies, fostering multi-level collaboration, and pro-viding seamless access to cutting-edge solutions, APECS aims to build a resilient and thriving community of interest that enables European companies, from Startups through SMEs to industry leaders, to play a key role in the global semiconductor market.
Purpose
Connecting and collaboratingThe APECS Pilot Line is dedicated to catalyze innovation and cooperation across Europe's semiconductor landscape. Our purpose is to bridge the gap between research, industry, and policy to drive the continent's competitiveness in advanced packaging and heterogeneous integration.
Pioneering InnovationAPECS leads the way in heterogeneous integration including various advanced packaging types by providing diverse technologies into a single platform that enables the innovative production tailored to Europe's industry needs. In the proposed pilot line, new functionalities will be activated as part of the System Technology Co-Optimization (STCO) ecosystem and integration technologies will be standardized. The platform of capabilities to be developed will include novel characterization, quality assurance, testing & reliability (CTR) methodologies. Facilitating multilevel Cooperation
APECS fosters cooperation between European RTOs, industry, academia, and policy makers to drive innovation through technology transfer, small volume prototyping and collaborative research, bringing a community of interest around next generation technologies for advanced packaging and heterogeneous integrated systems. Driving European competitiveness at peak performanceAPECS supports the creation of a robust, secure, and resilient European semiconductor supply chain, easing access for SMEs and startups to advanced technologies, helping them prototype and scale up production. Bonding around heterogeneous integration and advanced packagingThe platform of capabilities to be developed will include novel characterization, quality assurance, testing & reliability (CTR) methodologies and a System-Technology Co-Design (STCO) framework to ensure quality, reliability and fast production ramp-up in collaborating manufacturing organizations. Catalyzing fresh prospects for regional chip manufacturing
APECS strengthens European SMEs and start-ups by providing access to critical services, skills and training, opening up a brand new landscape of new markets and opportunities for European business models and a low-threshold, easily scalable industrial transfer of these newly developed innovations.
|